The future development trend of FPC is mainly manifested in three aspects: (1) The development of various sizes of display screens represented by TFT-LCD and PDP has driven the development of single- and double-sided FPC in the direction of high density. The lines are thinner and the aperture is smaller. The line width and line spacing of single-sided and double-sided FPC lines are 1.5mil/1.5mil, and the aperture of the small holes is 0.1mm-0.05mm. (2) The two-layer method FCCL flexible copper clad laminate material with high dimensional stability is adopted. With the demands of mobile phones with high flexibility requirements and TF T-LCD products with high dimensional stability requirements, the two-layer method FCCL flexible copper clad laminate material becomes cheaper as its process technology matures, and the two-layer method without glue The use of FCCL will increase in proportion. (3) Development towards COF (CHIP ON FLEX). Driven by the TFT-LCD and integrated circuit packaging substrate market, COF is developing optimistically. The line pitch of single-sided COF is 10μm, and the line pitch of double-sided COF is 15μm. , The pore diameter of the small hole is less than 50μm.