Laser technology is widely used in manufacturing

Because of its excellent monochromaticity, coherence and directional collimation, the laser is especially suitable for material processing. Laser processing is a promising field for laser applications, and more than 20 laser processing technologies have been developed.　　The space control and time control of the laser are very good, and the material, shape, size and processing environment of the processing object have great freedom, and it is especially suitable for automatic processing. The combination of laser processing system and computer numerical control technology can form high-efficiency automatic processing equipment, which has become a key technology for enterprises to implement timely production, opening up broad prospects for high-quality, high-efficiency and low-cost processing and production. Laser rapid prototyping technology integrates the new achievements of laser technology, CAD/CAM technology and material technology. According to the CAD model of the part, the photosensitive polymer material is solidified layer by layer with a laser beam, and accurately stacked into a sample, without the need for molds and tools. Quickly and accurately manufacture parts with complex shapes. This technology has been widely used in aerospace, electronics, automotive and other industrial fields. Laser cutting technology is widely used in the processing of metal and non-metal materials, which can greatly reduce processing time, reduce processing costs, and improve workpiece quality. Pulsed lasers are suitable for metallic materials, and continuous lasers are suitable for non-metallic materials. The latter is an important application field of laser cutting technology. Laser welding technology has a bath purification effect, can clean the weld metal, and is suitable for welding between the same and different metal materials.　　 Laser welding has high energy density, which is particularly advantageous for welding metals with high melting point, high reflectivity, high thermal conductivity and very different physical properties. In laser welding, a laser beam with a lower power than when cutting metal is used to melt the material without vaporizing it and become a continuous solid structure after cooling. Laser drilling technology has the advantages of high precision, strong versatility, high efficiency, low cost, and significant comprehensive technical and economic benefits. It has become one of the key technologies in the modern manufacturing field.　　Before the laser appeared, only the harder material could be used to make holes in the harder material. In this way, it is extremely difficult to drill holes in the hardest diamond. After the laser appeared, this type of operation was fast and safe.　　Laser marking technology is one of the application areas of laser processing. Laser marking is a marking method that uses a high-energy density laser to locally irradiate the workpiece to vaporize the surface material or cause a chemical reaction to change color, thereby leaving a permanent mark.　　Laser marking can produce a variety of characters, symbols and patterns, etc., and the size of the characters can range from millimeters to micrometers, which has special significance for the anti-counterfeiting of products. All-solid-state ultraviolet band laser marking is a new technology developed in recent years. It is especially suitable for metal marking and can achieve sub-micron marking. It has been widely used in the microelectronics industry and bioengineering.　Laser weight removal and balance technology is the process of using laser to remove the unbalanced and excessive part of the high-speed rotating parts, so that the inertial axis and the rotating axis are coincident to achieve dynamic balance. Laser weight-removal balance technology has two functions: measurement and weight-removal. It can measure and correct unbalance at the same time, which greatly improves the efficiency and has broad application prospects in the field of gyroscope manufacturing. For high-precision rotors, laser dynamic balancing can double the balance accuracy, and the balance accuracy of the mass eccentric value can reach 1% or a few thousandths of a micron.　　 Laser etching technology is simpler than traditional chemical etching technology, can greatly reduce production costs, and can process 0.15 to 1 micron wide lines, which is very suitable for the manufacture of very large-scale integrated circuits.　　 Laser fine-tuning technology can automatically and precisely fine-tune the resistance, with an accuracy of 0.01% to 0.002%, which is higher in accuracy and efficiency and lower in cost than traditional processing methods. Laser trimming includes the trimming of thin film resistors (0.01-0.6 microns thick) and thick film resistors (20-50 microns thick), capacitor trimming and hybrid integrated circuit trimming. Laser storage technology is a technology that uses lasers to record video, audio, text data and computer information (such as CDs, DVDs, etc.), and is one of the supporting technologies in the information age.